The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Mar. 01, 2011
Sebastian Brunner, Graz, AT;
Thomas Feichtinger, Graz, AT;
Günter Pudmich, Köflach, AT;
Horst Schlick, Vienna, AT;
Patrick Schmidt-winkel, Bad Gams, AT;
Sebastian Brunner, Graz, AT;
Thomas Feichtinger, Graz, AT;
Günter Pudmich, Köflach, AT;
Horst Schlick, Vienna, AT;
Patrick Schmidt-Winkel, Bad Gams, AT;
EPCOS AG, Munich, DE;
Abstract
A method for producing an electrical component () is proposed, in which a ceramic base body () that contains a through-hole contact () and at least one metallization surface (C) electroconductively connected to the through-hole contact is provided in a method step A). On the surface of the base body, an electrically insulating first material is arranged in layer form at least above the through-hole contact in method step B), and thereafter an electrically conductive second material is applied above through-hole contact () in method step C). Then a solder contact (B) that electroconductively connects through-hole contact () through passivation layer (B), which is formed from the first material by sintering, is formed by hardening in method step D).