The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8415196 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 09, 2013

Filed:

Dec. 25, 2008
Applicants:

Takahiro Ohe, Tokyo, JP;

Miki Kimijima, Tokyo, JP;

Inventors:

Takahiro Ohe, Tokyo, JP;

Miki Kimijima, Tokyo, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a method for forming a semiconductor thin film, which is capable of suppressing decrease in mobility due to heating and characteristic deterioration due to the decrease in mobility and which is capable of forming a semiconductor thin film with improved heat resistance by more simple procedures. A solution in which a plurality of types of organic materials including an organic semiconductor material are mixed is applied or printed on a substrate to form a thin film, and the plurality of types of organic materials are phase-separated by a process of drying the thin film. As a result, a layered structure semiconductor thin film is obtained, in which an intermediate layer b composed of an organic insulating material is sandwiched between two semiconductor layers a and a'.


Find Patent Forward Citations

Ohe, Takahiro. (2013). Method for forming semiconductor thin film and method for manufacturing thin-film semiconductor device (U.S. Patent No. 8415196). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8415196

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