The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Nov. 12, 2009
Yu-hsien Lee, Kaohsiung, TW;
Chen-hsin Huang, Kaohsiung, TW;
Feng-jung Tien, Kaohsiung, TW;
Tzu-ching Hung, Kaohsiung, TW;
Yu-Hsien Lee, Kaohsiung, TW;
Chen-Hsin Huang, Kaohsiung, TW;
Feng-Jung Tien, Kaohsiung, TW;
Tzu-Ching Hung, Kaohsiung, TW;
Taiflex Scientific Co., Ltd., Kaohsiung, TW;
Abstract
A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile