The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2013

Filed:

Sep. 17, 2009
Applicants:

Eigo Kawakami, Utsunomiya, JP;

Kazuyuki Kasumi, Utsunomiya, JP;

Hideki Ina, Tokyo, JP;

Inventors:

Eigo Kawakami, Utsunomiya, JP;

Kazuyuki Kasumi, Utsunomiya, JP;

Hideki Ina, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/22 (2006.01); B29B 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An imprint apparatus molds resin dispensed on a shot region of a substrate with a mold and forms a pattern of resin on the shot region. The apparatus includes a mold stage configured to hold the mold, a substrate stage configured to hold the substrate, a drive mechanism configured to change a relative positional relationship between the mold stage and the substrate stage in an X-Y plane that defines a coordinate of the shot region and a Z-axis direction perpendicular to the X-Y plane, and a controller. The controller is configured to control the drive mechanism so that the mold and the shot region perform relative vibration, in the X-Y plane, with respect to a relative position where the mold and the shot region align, and a distance between the mold and the shot region decreases in the Z-axis direction in parallel with the vibration, and the resin is molded by the mold.


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