The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8413576 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 09, 2013

Filed:

Jun. 14, 2007
Applicants:

Shunpu LI, Ontario, GB;

Christopher Newsome, Cambridge, GB;

Daping Chu, Cambridge, GB;

Inventors:

Shunpu Li, Ontario, GB;

Christopher Newsome, Cambridge, GB;

Daping Chu, Cambridge, GB;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B31F 1/07 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabricating a bank structure, includes: (a) forming a multi-layer structure on an underlying surface thereof, the multi-layer structure having at least a first layer and a second layer, (b) embossing the second layer so as to define a bank pattern in the second layer, (c) transferring the bank pattern to the first layer so as to form a bank structure defining an indented region; and (d) removing the second layer after the step (c) so as to expose a surface of the first layer as a top surface of the bank structure.


Find Patent Forward Citations

Li, Shunpu. (2013). Method of fabricating a structure (U.S. Patent No. 8413576). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8413576

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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