The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Mar. 05, 2010
Applicants:
Sebastian Brunner, Graz, AT;
Franz Kaul, Penzberg, DE;
Annette Fischer, Lannach, AT;
Inventors:
Assignee:
Epcos AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 7/10 (2006.01); H05K 7/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A module substrate includes a multilayer substrate that includes a plurality of layers, a bottommost of the layers being a ceramic layer. Solderable contacts, which include fired pads composed of a conductive paste, are applied to the bottommost ceramic layer. A covering layer overlies the pads. The covering layer covers all outer edges of the pads. A window is cut out of the covering layer. A metallic coating is applied to each pad exclusively within the window.
Brunner, Sebastian. (2013). Module substrate and production method (U.S. Patent No. 8413321). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8413321
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile