The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2013

Filed:

May. 06, 2004
Applicants:

Michael P. Wallace, Fremont, CA (US);

Robert J. Garabedian, Mountain View, CA (US);

John Eric Peckham, Sunnyvale, CA (US);

Inventors:

Michael P. Wallace, Fremont, CA (US);

Robert J. Garabedian, Mountain View, CA (US);

John Eric Peckham, Sunnyvale, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

An expandable intravascular medical device is provided. The medical device comprises an expandable tubular body that includes an integrated resilient support structure that forms a plurality of electrically conductive regions to which the lead(s) is coupled. The tubular body further includes at least one electrically insulative element disposed between the conductive regions. In one embodiment, the support structure is skeletal in nature, e.g., it can be formed of a mesh, braid, or coil. The conductive regions can be variously formed by the support structure. For example, the support structure may comprise electrically conductive sub-structures that form the conductive regions. In this case, the sub-structures may be mechanically linked together by the insulative element(s), or they can be directly linked together, and the insulative element(s) can take the form of insulative layer(s) disposed on one or more of the conductive sub-structures. As another example, the support structure can have a conductive core and insulative material disposed over portions of the conductive core. In this case, the exposed core portions form the conductive regions, and the unexposed core portions form the insulative element(s).


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