The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Feb. 22, 2010
Kenji Kondo, Nara, JP;
Masahito Hidaka, Osaka, JP;
Koji Kuyama, Hyogo, JP;
Yutaka Kamogi, Osaka, JP;
Kenji Kondo, Nara, JP;
Masahito Hidaka, Osaka, JP;
Koji Kuyama, Hyogo, JP;
Yutaka Kamogi, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A mounting structurein which an electronic componentis surface-mounted with solderto a wiring substrateis disclosed. The solder is Sn—Ag—Bi—In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from −40 to 150° C. has been suppressed.