The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Sep. 18, 2008
Makoto Uchida, Tokyo, JP;
Shigeru Moteki, Tokyo, JP;
Ryutaro Tanaka, Tokyo, JP;
Hiromi Morita, Tokyo, JP;
Makoto Uchida, Tokyo, JP;
Shigeru Moteki, Tokyo, JP;
Ryutaro Tanaka, Tokyo, JP;
Hiromi Morita, Tokyo, JP;
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Abstract
The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, Rrepresents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3',4′-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3′,4′-benzophenone tetracarboxylic acid, Rrepresents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4′-hydroxydiphenylsulfone, 4,4′-diamino-3,3′5,5′-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor device has an extremely improved adhesiveness between said lead frame and a cured product of a sealing resin composition and also is excellent in heat resistance and low moisture absorption.