The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Aug. 21, 2009
Applicants:
Yasuo Matsumi, Tsukuba, JP;
Mitsuo Maeda, Tsukuba, JP;
Inventors:
Yasuo Matsumi, Tsukuba, JP;
Mitsuo Maeda, Tsukuba, JP;
Assignee:
Sumitomo Chemical Company, Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A pressure loss section H(H) extends from a position corresponding to a corner of a resin package, and Sis the minimum value of the opening area of the pressure loss section H(H) perpendicular to the direction of resin flow (X axis) in the pressure loss section H(H) during resin molding, while Sis the average value of the opening areas of excess resin reservoirs Hto Hperpendicular to the direction of resin flow (Y axis) within excess resin reservoir Hto Hduring molding. In this lead frame, S<Sis satisfied.