The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Jul. 23, 2010
Ikuo Yoshihara, Kanagawa, JP;
Masaya Nagata, Kanagawa, JP;
Naoto Sasaki, Kanagawa, JP;
Taku Umebayashi, Kanagawa, JP;
Hiroshi Takahashi, Kanagawa, JP;
Yoichi Otsuka, Kanagawa, JP;
Isaya Kitamura, Kumamoto, JP;
Tokihisa Kaneguchi, Kumamoto, JP;
Keishi Inoue, Kanagawa, JP;
Toshihiko Hayashi, Kanagawa, JP;
Hiroyasu Matsugai, Kanagawa, JP;
Mayoshi Aonuma, Kanagawa, JP;
Hiroshi Yoshioka, Kanagawa, JP;
Ikuo Yoshihara, Kanagawa, JP;
Masaya Nagata, Kanagawa, JP;
Naoto Sasaki, Kanagawa, JP;
Taku Umebayashi, Kanagawa, JP;
Hiroshi Takahashi, Kanagawa, JP;
Yoichi Otsuka, Kanagawa, JP;
Isaya Kitamura, Kumamoto, JP;
Tokihisa Kaneguchi, Kumamoto, JP;
Keishi Inoue, Kanagawa, JP;
Toshihiko Hayashi, Kanagawa, JP;
Hiroyasu Matsugai, Kanagawa, JP;
Mayoshi Aonuma, Kanagawa, JP;
Hiroshi Yoshioka, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile