The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Oct. 29, 2008
Atsushi Yamaguchi, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Koso Matsuno, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Koso Matsuno, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.