The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Mar. 05, 2010
Masakazu Sakaguchi, Yokkaichi, JP;
Kouki Nishijima, Yokkaichi, JP;
Masaharu Oikawa, Yokkaichi, JP;
JSP Corporation, Tokyo, JP;
Abstract
Provided are polyvinylidene fluoride resin expanded beads which can be molded by in-mold molding and thus stably provide, without impairing excellent characteristics inherent in polyvinylidene fluoride resin, molded articles having excellent mechanical properties. Polyvinylidene fluoride resin expanded beads, characterized in that when 1 to 3 mg of the expanded beads are subjected to heat-flux type differential scanning calorimetry (DSC) wherein the beads are heated from 25° C. to 200° C. at a temperature rise rate of 10° C./min, the obtained DSC curve (of first heating) has both an inherent endothermic peak which is inherent in polyvinylidene fluoride resin and one or more higher-temperature endothermic peaks which appear on the higher-temperature side of the inherent endothermic peak, the quantity of heat of melting of the higher-temperature endothermic peaks being at least 0.5 J/g.