The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Apr. 20, 2010
Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
Lynne E. Dellis, Willow Spring, NC (US);
Karl Hartmann Dietz, Raleigh, NC (US);
David Ross Mcgregor, Apex, NC (US);
Lynne E. Dellis, Willow Spring, NC (US);
Karl Hartmann Dietz, Raleigh, NC (US);
David Ross McGregor, Apex, NC (US);
CDA Procesing Limited Liability Company, Wilmington, DE (US);
Abstract
Disclosed are methods of making a semiconductor package comprising at least one thin-film capacitor embedded into at least one build-up layer of said semiconductor package. A thin-film capacitor is provided wherein the thin-film capacitor has a first electrode and a second electrode separated by a dielectric. A temporary carrier layer is applied to the first electrode and the second electrode is patterned. A PWB core and a build-up material are provided, and the build-up material is placed between the PWB core and the patterned second electrode of said thin-film capacitor. The patterned electrode side of the thin-film capacitor is laminated to the PWB core by way of the build-up material, the temporary carrier layer is removed, and the first electrode is patterned.