The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Apr. 23, 2008
Katsuhiko Funaki, Sunnyvale, CA (US);
Etsuo Ohkawado, Chiba, JP;
Kousuke Hirota, Urayasu, JP;
Syuji Tahara, Ichihara, JP;
Katsuhiko Funaki, Sunnyvale, CA (US);
Etsuo Ohkawado, Chiba, JP;
Kousuke Hirota, Urayasu, JP;
Syuji Tahara, Ichihara, JP;
Mitsui Chemicals, Inc., Minato-Ku, Tokyo, JP;
Abstract
Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, Rrepresents a hydrogen atom or a methyl group; Rrepresents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].