The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Jun. 01, 2009
Applicants:
Chang-han Shim, Changwon, KR;
Sung-il Kang, Changwon, KR;
Se-chuel Park, Changwon, KR;
Inventors:
Assignee:
Samsung Techwin Co., Ltd., Changwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.