The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Dec. 30, 2010
Applicants:
Tae-hyoung Huh, Gyeonggi-do, KR;
Kwi-dong Kim, Gyeonggi-do, KR;
Inventors:
Tae-Hyoung Huh, Gyeonggi-do, KR;
Kwi-Dong Kim, Gyeonggi-do, KR;
Assignee:
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/00 (2006.01); G11C 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a memory controller chip, a plurality of first memory chips configured to store normal data, a second memory chip configured to store error information for correcting or detecting error of the normal data, and an interface unit configured to interface the memory controller chip, the plurality of first memory chips, and the second memory chip.
Huh, Tae-Hyoung. (2013). Semiconductor package (U.S. Patent No. 8407538). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8407538
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile