The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8407032 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 26, 2013

Filed:

Jun. 10, 2010
Applicants:

Punit Tiwari, Bangalore, IN;

Madhusudhana Reddy, Bangalore, IN;

Andreas Wick, Hamburg, DE;

Inventors:

Punit Tiwari, Bangalore, IN;

Madhusudhana Reddy, Bangalore, IN;

Andreas Wick, Hamburg, DE;

Assignee:

Airbus Engineering Centre India, Bangalore, Karnataka, IN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06G 7/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (h) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q″) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (t) of each body part of the one or more thermal manikins using the obtained associated h, the obtained associated q″, and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed t.


Find Patent Forward Citations

Tiwari, Punit. (2013). System and method for numerically evaluating thermal comfort inside an enclosure (U.S. Patent No. 8407032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8407032

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