The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2013

Filed:

Jun. 02, 2010
Applicants:

Saori Hamamura, Kawasaki, JP;

Naoki Matsushima, Chiba, JP;

Madoka Minagawa, Yokohama, JP;

Satoshi Kaneko, Yokohama, JP;

Norio Chujo, Tokyo, JP;

Yasunobu Matsuoka, Hachioji, JP;

Toshiki Sugawara, Tokyo, JP;

Tsutomu Kono, Yokohama, JP;

Inventors:

Saori Hamamura, Kawasaki, JP;

Naoki Matsushima, Chiba, JP;

Madoka Minagawa, Yokohama, JP;

Satoshi Kaneko, Yokohama, JP;

Norio Chujo, Tokyo, JP;

Yasunobu Matsuoka, Hachioji, JP;

Toshiki Sugawara, Tokyo, JP;

Tsutomu Kono, Yokohama, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. Optical devicesandare disposed on a circuit board, so that they are optically coupled with optical guidesformed on the circuit board, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film, and an electric wiring layeris laminated, so that the electrodes of the optical devicesand wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing. Also, it has the structure of not causing deterioration of the optical devices due to ill influences of moisture, thereby achieving high reliability. Further, it also produces an easy connecting method with a transmission apparatus, and high productivity thereof.


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