The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Oct. 01, 2010
Berk Yesin, Zurich, CH;
Bruno Agostini, Dietikon, CH;
Christoph Haederli, Zürich, CH;
Chunlei Liu, Zürich, CH;
Francesco Agostini, Zofingen, CH;
Hamit Duran, Turgi, CH;
Slavo Kicin, Zürich, CH;
Berk Yesin, Zurich, CH;
Bruno Agostini, Dietikon, CH;
Christoph Haederli, Zürich, CH;
Chunlei Liu, Zürich, CH;
Francesco Agostini, Zofingen, CH;
Hamit Duran, Turgi, CH;
Slavo Kicin, Zürich, CH;
ABB Research Ltd., Zurich, CH;
Abstract
A power-electronic arrangement comprising semiconductor components (), a heat exchanger (), and an electrically conductive element () is presented. The heat exchanger comprises evaporator channels () and condenser channels () for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.