The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Jun. 29, 2010
Masayoshi Nishihata, Chiryu, JP;
Yasushi Ookura, Okazaki, JP;
Masayoshi Nishihata, Chiryu, JP;
Yasushi Ookura, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
A semiconductor device includes a semiconductor element, a first heat sink, a second heat sink, and a resin member. The semiconductor element has first and second surfaces. The first heat sink has a first heat radiation surface and a first end surface. The first end surface is coupled with the first surface. The second heat sink has a second heat radiation surface, the second end surface being opposite the second heat radiation surface, and a depressed section depressed toward the second heat radiation surface. The second surface of the semiconductor element is coupled with a bottom surface of the depressed section. The resin member is disposed in the depressed section and seals the semiconductor element, the first heat sink, and the second heat sink in such a manner that the first heat radiation surface is exposed outside the resin member.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile