The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2013

Filed:

Sep. 22, 2011
Applicants:

Li-chih Yu, Tao-Yuan Hsien, TW;

Tse-an Lee, Tao-Yuan Hsien, TW;

Jen-chun Wang, Tao-Yuan Hsien, TW;

Yu-te Lin, Tao-Yuan Hsien, TW;

Yih-rern Peng, Tao-Yuan Hsien, TW;

Inventors:

Li-Chih Yu, Tao-Yuan Hsien, TW;

Tse-An Lee, Tao-Yuan Hsien, TW;

Jen-Chun Wang, Tao-Yuan Hsien, TW;

Yu-Te Lin, Tao-Yuan Hsien, TW;

Yih-Rern Peng, Tao-Yuan Hsien, TW;

Assignee:

Elite Material Co., Ltd., Tao-Yuan Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/357 (2006.01);
U.S. Cl.
CPC ...
Abstract

A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.


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