The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Mar. 31, 2008
Yuuki Nakamura, Hitachi, JP;
Tsutomu Kitakatsu, Hitachi, JP;
Youji Katayama, Hitachi, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Yuuki Nakamura, Hitachi, JP;
Tsutomu Kitakatsu, Hitachi, JP;
Youji Katayama, Hitachi, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
There is provided an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at low temperature and which allows semiconductor chips to be obtained at high yield from the semiconductor wafer while sufficiently inhibiting generation of chip cracks and burrs. The adhesive film for a semiconductor comprises a polyimide resin that can be obtained by reaction between a tetracarboxylic dianhydride containing 4,4'-oxydiphthalic dianhydride represented by chemical formula (I) below and a diamine containing a siloxanediamine represented by the following general formula (II) below, and that can be attached to a semiconductor wafer at 100° C. or below.