The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Nov. 15, 2010
Kazuya Maruyama, Kanagawa, JP;
Toshikazu Ishikawa, Kanagawa, JP;
Jun Matsuhashi, Kanagawa, JP;
Takashi Kikuchi, Kanagawa, JP;
Kazuya Maruyama, Kanagawa, JP;
Toshikazu Ishikawa, Kanagawa, JP;
Jun Matsuhashi, Kanagawa, JP;
Takashi Kikuchi, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy.