The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2013

Filed:

Mar. 31, 2004
Applicants:

Fred C. Redeker, Fremont, CA (US);

John M. Boyd, Atascadero, CA (US);

Yezdi Dordi, Palo Alto, CA (US);

Sabir A. Majumder, Fremont, CA (US);

Simon Mcclatchie, Fremont, CA (US);

Inventors:

Fred C. Redeker, Fremont, CA (US);

John M. Boyd, Atascadero, CA (US);

Yezdi Dordi, Palo Alto, CA (US);

Sabir A. Majumder, Fremont, CA (US);

Simon McClatchie, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 7/19 (2006.01); B24B 7/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for producing a normalized surface on a substrate for a chemical mechanical planarization process is provided. The method initiates with grinding a surface of the substrate with a first surface associated with a first planarization length. The method includes planarizing the surface of the substrate with a second surface associated with a second planarization length. Here, the second planarization length being less than the first planarization length. A system for processing a semiconductor substrate is also provided.


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