The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Nov. 04, 2009
Applicants:
Takehiro Nakata, Yokkaichi, JP;
Michiaki Okamoto, Yokkaichi, JP;
Takuya Inoue, Yokkaichi, JP;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
It is aimed not to increase contact resistance between a wire and a wire crimping portion even upon being subjected to a thermal cycle. A gold plating layer is formed on a base metal () via a nickel plating layer () in a terminal contact portion () to be held in contact with a mating terminal. A tin plating layer () is formed on the base metal () without via the nickel plating layer () in a wire crimping portion () to be crimped and connected to a core () of an insulated wire ().