The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Apr. 17, 2009
Takashi Sato, Yamagata, JP;
Giichiro Saito, Yamagata, JP;
Takashi Sato, Yamagata, JP;
Giichiro Saito, Yamagata, JP;
Teikoku Piston Ring Co., Ltd., Tokyo, JP;
Teipi Industry Co., Ltd., Sagae-shi, JP;
Abstract
Evaluation results are shown in Table 1. The embodiments 1-9 possess a high thermal conductivity and high bonding strength. However, the thermal conductivity has dropped in the comparative examples 1, 2 and 4 with a low surface area ratio and in the comparative example 3 with a high surface area ratio. The comparative example 2 with a low projection height has a low bonding strength, and the comparative example 3 with a high projection height has a drop in the thermal conductivity. The thermal conductivity has declined in the comparative example 1 with relatively few projections, and the thermal conductivity has declined in the comparative example 4 with many projections. The comparative example 5 with no projections and having a rough casting surface does not have sufficient bonding strength.