The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Nov. 23, 2009
Naoki Matsushima, Yokohama, JP;
Norio Chujo, Tokyo, JP;
Yasunobu Matsuoka, Hachioji, JP;
Toshiki Sugawara, Kokubunji, JP;
Madoka Minagawa, Yokohama, JP;
Saori Hamamura, Fujisawa, JP;
Satoshi Kaneko, Yokohama, JP;
Tsutomu Kono, Yokohama, JP;
Naoki Matsushima, Yokohama, JP;
Norio Chujo, Tokyo, JP;
Yasunobu Matsuoka, Hachioji, JP;
Toshiki Sugawara, Kokubunji, JP;
Madoka Minagawa, Yokohama, JP;
Saori Hamamura, Fujisawa, JP;
Satoshi Kaneko, Yokohama, JP;
Tsutomu Kono, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI (device) having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.