The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Oct. 23, 2009
Ki Young Kim, Gyeonggi-do, KR;
Sung Ho Hyun, Seoul, KR;
Myung Geun Park, Seoul, KR;
Woong Sun Lee, Gyeonggi-do, KR;
Ki Young Kim, Gyeonggi-do, KR;
Sung Ho Hyun, Seoul, KR;
Myung Geun Park, Seoul, KR;
Woong Sun Lee, Gyeonggi-do, KR;
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a semiconductor chip having a first surface, a second surface located opposite the first surface, and side surfaces connecting the first and second surfaces. The semiconductor chip includes bonding pads disposed on the first surface and having a molding member formed to cover the first surface of the semiconductor chip. The molding member is formed so as to expose the side surfaces of the semiconductor chip. The semiconductor chip also includes bonding members having first ends electrically connected to the respective bonding pads and second ends that are connected to and opposite the first ends. The second ends are exposed from side surfaces of the molding member after passing through the molding member so as to allow various electrical connections.