The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Aug. 30, 2005
Klaus Schultes, Wiesbaden, DE;
Peter Battenhausen, Brachttal-Udenhain, DE;
Ursula Golchert, Dieburg, DE;
Stefan Nau, Buettelborn, DE;
Werner Hoess, Shanghai, CN;
Klaus Schultes, Wiesbaden, DE;
Peter Battenhausen, Brachttal-Udenhain, DE;
Ursula Golchert, Dieburg, DE;
Stefan Nau, Buettelborn, DE;
Werner Hoess, Shanghai, CN;
Evonik Roehm GmbH, Darmstadt, DE;
Abstract
The invention relates to the use of polyalkyl(meth)acrylate bead polymers with an average particle size Vthat ranges between 30 and 70 μm for improving the stress cracking resistance of moulding materials containing polyalkyl(meth)acrylate. The invention also relates to moulding materials comprising: a) at least 50 wt. % of an impact resistance modifying agent, which contains at least one polyalkyl(meth)acrylate phase; b) at least 8 wt. % of a polyalkyl(meth)acrylate bead polymer with an average particle size Vthat ranges between 30 and 70 μm; and c) between 0 and 42 wt. % of a polyalkyl(meth)acrylate with a molecular weight ranging between 20,000 and 350,000 g/mol, whereby the wt. % of the components a) to c) amounts to 100 wt. %, and to moulded bodies that can be obtained from said materials.