The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2013

Filed:

Mar. 20, 2009
Applicants:

Naoya Sakamoto, Tochigi, JP;

Takahiro Sato, Tochigi, JP;

Yoshiaki Oikawa, Tochigi, JP;

Rai Sato, Tochigi, JP;

Yamato Aihara, Tochigi, JP;

Takayuki Cho, Tochigi, JP;

Masami Jintyou, Tochigi, JP;

Inventors:

Naoya Sakamoto, Tochigi, JP;

Takahiro Sato, Tochigi, JP;

Yoshiaki Oikawa, Tochigi, JP;

Rai Sato, Tochigi, JP;

Yamato Aihara, Tochigi, JP;

Takayuki Cho, Tochigi, JP;

Masami Jintyou, Tochigi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
Abstract

A conductive film containing aluminum or an aluminum alloy with a thickness equal to or greater than 1 μm and equal to or less than 10 μm is etched by wet-etching to be a predetermined thickness, and then etched by dry-etching, whereby side-etching of the conductive film can be suppressed and thickness reduction of a mask can be suppressed. The suppression of side-etching of the conductive film and the suppression of thickness reduction of the mask enable a conductive film containing aluminum or an aluminum alloy even with a large thickness equal to or greater than 1 μm and equal to or less than 10 μm to be etched such that the gradient of the edge portion of the conductive film can be steep, a predetermined thickness of the conductive film can be obtained, and shape difference from a mask pattern can be suppressed.


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