The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Dec. 20, 2010
Kwon Whan Han, Seoul, KR;
Kwon Whan Han, Seoul, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
A stacked semiconductor package includes a semiconductor chip module including at least two semiconductor chips, each semiconductor chip having a first face, a second face opposite to the first face, and a circuit part. A through portion passes through the first and second faces of the semiconductor chip. A recess part is formed in a portion of the second face where the second face and the through portion meet. A through electrode is electrically connected to the circuit part and is disposed inside of the through portion. A connection member is disposed in the recess part to electrically connect the through electrodes of adjacent stacked semiconductor chips. And the semiconductor chip module is mounted to a substrate. The stacked semiconductor package prevents both gaps between semiconductor chips and misalignment of the through electrode.