The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Dec. 01, 2011
Chun-ming Huang, Hsinchu, TW;
Chi-sheng Lin, Hsinchu, TW;
Chi-shi Chen, Hsinchu, TW;
Chien-ming Wu, Hsinchu, TW;
Chun-Ming Huang, Hsinchu, TW;
Chi-Sheng Lin, Hsinchu, TW;
Chi-Shi Chen, Hsinchu, TW;
Chien-Ming Wu, Hsinchu, TW;
Abstract
The present invention provides a method for manufacturing a modularized integrated circuit (IC). The method includes the following steps: providing a base; and coupling an input/output module with the base. The base includes a lead-frame and a first package. The first package covers the lead-frame but exposes first contact points. The input/output module includes a first substrate, a plurality of first conducting columns, and a plurality of third contact points. A portion of each of the third contact points is electrically connected to a corresponding one of the first contact points. The method enhances the flexibility of IC design, and reduces the time and costs of developing new process techniques.