The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Oct. 09, 2011
Christopher L. Chua, San Jose, CA (US);
Bowen Cheng, Palo Alto, CA (US);
Eugene M. Chow, Fremont, CA (US);
Dirk DE Bruyker, San Jose, CA (US);
Christopher L. Chua, San Jose, CA (US);
Bowen Cheng, Palo Alto, CA (US);
Eugene M. Chow, Fremont, CA (US);
Dirk De Bruyker, San Jose, CA (US);
Palo Alto Research Center Incorporated, Palo Alto, CA (US);
Abstract
A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.