The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2013

Filed:

May. 03, 2012
Applicants:

Eugen Abramovici, Toronto, CA;

David E. Gevers, Lafayette, IN (US);

Lucian M. Silvian, West Lafayette, IN (US);

Inventors:

Eugen Abramovici, Toronto, CA;

David E. Gevers, Lafayette, IN (US);

Lucian M. Silvian, West Lafayette, IN (US);

Assignee:

Nexgeneering Technology LLC, West Lafayette, IN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 9/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.


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