The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2013

Filed:

Sep. 10, 2010
Applicants:

Hajime Nishio, Ibaraki, JP;

Masayuki Hodono, Ibaraki, JP;

Inventors:

Hajime Nishio, Ibaraki, JP;

Masayuki Hodono, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H04B 10/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion () is formed in a surface of an over cladding layer () of the optical waveguide section (W). At least part of the light-emitting section () or the light-receiving section of the semiconductor chip () for opto-electric conversion and at least part of a loop portion () of a bonding wire () in the opto-electric conversion substrate section (E) are positioned within the recessed portion (). This brings the light-emitting section () or the light-receiving section of the semiconductor chip () and the reflecting surface () formed in the core () closer to each other.


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