The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Jun. 23, 2010
Takayoshi Matsumura, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Shuichi Takeuchi, Kawasaki, JP;
Tetsuya Takahashi, Kawasaki, JP;
Takayoshi Matsumura, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Shuichi Takeuchi, Kawasaki, JP;
Tetsuya Takahashi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.