The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8395248 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 12, 2013

Filed:

Mar. 18, 2010
Applicant:

Yoshiaki Nozaki, Osaka, JP;

Inventor:

Yoshiaki Nozaki, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a lead framehaving a first lead, a second leadand a third lead. A power transistoris placed on the first lead, and the power transistoris connected to the first lead. The power transistorhas a drain electrode on one side opposite to a first leadside, and this drain electrode is connected to a Cu chipon the power transistor. The Cu chipis connected to the second leadvia Al wires. As a result, during wire bonding of the Al wires, it becomes possible to absorb shocks due to wire bonding by the Cu chip, or disperse pressure due to wire bonding by the Cu chip, or diffuse heat due to wire bonding by the Cu chip


Find Patent Forward Citations

Nozaki, Yoshiaki. (2013). Semiconductor device and manufacturing method therefor (U.S. Patent No. 8395248). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8395248

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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