The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2013

Filed:

Apr. 16, 2008
Applicants:

Hidehiro Sasaki, Kawachi-gun, JP;

Yasunori Nakamura, Yokkaichi, JP;

Inventors:

Hidehiro Sasaki, Kawachi-gun, JP;

Yasunori Nakamura, Yokkaichi, JP;

Assignee:

JSP Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08J 9/16 (2006.01); C08J 9/22 (2006.01); C08J 9/228 (2006.01); C08J 9/35 (2006.01);
U.S. Cl.
CPC ...
Abstract

Improved polypropylene resin foamed beads that without detriment to the excellence in properties, such as compression properties and heat resistance, characterizing the polypropylene resin foamed beads, can provide a polypropylene resin foamed bead molded article with equal properties by an molding conducted at low heating temperature. There are disclosed polypropylene resin foamed beads composed of a polypropylene resin of 115 to 135° C. melting point and 500 MPa or higher Olsen flexural modulus. The amount of ash at the surface of the foamed beads is 3000 wt. ppm or less (including 0). With respect to the foamed beads, in the first DSC curve obtained by heating 1 to 3 mg of polypropylene resin foamed beads from room temperature to 200° C. at a temperature elevation rate of 10° C./min by the use of a differential scanning calorimeter, there appear not only one or more endothermic peak (Pa) having the peak temperature within a temperature zone not higher than the melting point of the resin but also one or more endothermic peak (Pb) having the peak temperature within a temperature zone exceeding the melting point of the resin and not lower than 130° C. The total calorific value of the endothermic peak (Pb) is in the range of 2 to 12 J/g. Further, there is disclosed a foamed bead molded article obtained by molding the above foamed beads.


Find Patent Forward Citations

Loading…