The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Dec. 15, 2008
Masumi Kuroyama, Kariya, JP;
Kazuo Kato, Kariya, JP;
Tomonori Ishikawa, Kariya, JP;
Yaeko Sasaki, Morioka, JP;
Setsuko Sato, Morioka, JP;
Masayuki Nakamura, Morioka, JP;
Shuhei Miura, Morioka, JP;
Masumi Kuroyama, Kariya, JP;
Kazuo Kato, Kariya, JP;
Tomonori Ishikawa, Kariya, JP;
Yaeko Sasaki, Morioka, JP;
Setsuko Sato, Morioka, JP;
Masayuki Nakamura, Morioka, JP;
Shuhei Miura, Morioka, JP;
Toadenka Corporation, Morioka-shi, Iwate, JP;
Abstract
Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10%≦CuO/(CuO+CuO)≦75%. Preferably, this resin-metal bonded article further contains a triazine thiol derivative in the resin-component-side bonding surface of the copper component.