The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Feb. 23, 2009
Kazuaki Matsumoto, Settsu, JP;
Yasushi Kakehashi, Settsu, JP;
Kazuaki Matsumoto, Settsu, JP;
Yasushi Kakehashi, Settsu, JP;
Kaneka Corporation, Osaka-Shi, JP;
Abstract
An object of the present invention is to industrially easily mold a molded article which is excellent in thermal conductivity, electric insulation property, low density, and an injection moldability and has a thermal conduction anisotropy. The present invention relates to a highly thermally conductive resin molded article having a thermal diffusion anisotropy, the highly thermally conductive resin molded article comprising a resin composition, the resin composition containing at least resin (A) and plate-like hexagonal boron nitride powder (B) in a (A)/(B) volume ratio falling within a range of 90/10 to 30/70, the resin (A) including a thermoplastic polyester resin and/or a thermoplastic polyamide resin, the highly thermally conductive resin molded article having a thickness of not more than 1.3 mm in a part of or all over a three-dimensional shape of the highly thermally conductive resin molded article, a thermal diffusivity measured in a plane direction of the highly thermally conductive resin molded article, being (i) two or more times higher than a thermal diffusivity measured in a thickness direction of the highly thermally conductive resin molded article and (ii) not less than 0.5 mm/sec.