The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Jul. 24, 2008
Woo-ram Lee, Daejeon, KR;
Sang-ho Kim, Daejeon, KR;
Tae-su Kim, Daejeon, KR;
So-won Kim, Daejeon, KR;
Woo-Ram Lee, Daejeon, KR;
Sang-Ho Kim, Daejeon, KR;
Tae-Su Kim, Daejeon, KR;
So-Won Kim, Daejeon, KR;
LG Chem, Ltd., Seoul, KR;
Abstract
A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper-based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed.