The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2013

Filed:

Mar. 08, 2011
Applicants:

Yueli Wang, Cary, NC (US);

Richard John Sheffield Young, Somerset, GB;

Alan Frederick Carroll, Raleigh, NC (US);

Kenneth Warren Hang, Hillsborough, NC (US);

Inventors:

Yueli Wang, Cary, NC (US);

Richard John Sheffield Young, Somerset, GB;

Alan Frederick Carroll, Raleigh, NC (US);

Kenneth Warren Hang, Hillsborough, NC (US);

Assignee:

E I du Pont de Nemours and Company, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/24 (2006.01); B05D 5/12 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Zn-containing additive wherein the particle size of said zinc-containing additive is in the range of 7 nanometers to less than 100 nanometers; (c) glass frit wherein said glass frit has a softening point in the range of 300 to 600° C.; dispersed in (d) organic medium. The present invention is further directed to a semiconductor device and a method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film the thick film composition as describe above; and (b) firing said semiconductor, insulating film and thick film composition to form an electrode.


Find Patent Forward Citations

Loading…