The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2013

Filed:

Apr. 13, 2012
Applicants:

Tsuyoshi Himori, Osaka, JP;

Masaaki Katsumata, Osaka, JP;

Toshikazu Kondou, Osaka, JP;

Inventors:

Tsuyoshi Himori, Osaka, JP;

Masaaki Katsumata, Osaka, JP;

Toshikazu Kondou, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.


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