The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Sep. 29, 2008
Ichiro Hirata, Tokyo, JP;
Ichiro Hirata, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
Provided is highly accurate three-dimensional board warp analysis technology that can optimize at a development design phase material quality, size, reflow heating profile, or the like of a printed wiring board and various kinds of electronic components mounted on the board. The invention is characterized in comprising a model making-out means that adds a characteristic value of a material to shape data indicative of a shape of board to make out model data, a model division means that carries out vertical and lateral divisions equally base on the model data, a calculation means that calculates warp of cutting plane and a counter sectional plane of each of the divided models, and a conversion means that connects the cutting planes with each other after the calculation and converts them into warp data on the entire coordinate system.