The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2013

Filed:

Apr. 20, 2009
Applicants:

Satish Chandra Chaparala, Painted Post, NY (US);

Martin Hai HU, Painted Post, NY (US);

Lawrence Charles Hughes, Jr., Corning, NY (US);

Chung-en Zah, Holmdel, NJ (US);

Inventors:

Satish Chandra Chaparala, Painted Post, NY (US);

Martin Hai Hu, Painted Post, NY (US);

Lawrence Charles Hughes, Jr., Corning, NY (US);

Chung-En Zah, Holmdel, NJ (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/097 (2006.01);
U.S. Cl.
CPC ...
Abstract

Metallization patterns are provided to reduce the probability of chip fracture in semiconductor lasers. According to one embodiment disclosed herein, the pad edges of a metallization pattern extend across a plurality of crystallographic planes in the laser substrate. In this manner, cracks initiated at any given stress concentration would need to propagate across many crystallographic planes in the substrate to reach a significant size. Additional embodiments of the present disclosure relate to the respective geometries and orientations of adjacent pairs of contact pads. Still further embodiments are disclosed and claimed.


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