The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2013

Filed:

Oct. 01, 2010
Applicants:

Alex Horng, Kaohsiung, TW;

Chi-hung Kuo, Kaohsiung, TW;

Chih-hao Chung, Kaohsiung, TW;

Inventors:

Alex Horng, Kaohsiung, TW;

Chi-Hung Kuo, Kaohsiung, TW;

Chih-Hao Chung, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A heat conducting adhesive is filled in the through-hole. The heat conducting adhesive is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the heat conducting adhesive to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs.


Find Patent Forward Citations

Loading…