The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Oct. 03, 2003
Vahid Goudarzi, Coral Springs, FL (US);
Juli A. Abdala, SW Ranches, FL (US);
Gulten Goudarzi, Coral Springs, FL (US);
Vahid Goudarzi, Coral Springs, FL (US);
Juli A. Abdala, SW Ranches, FL (US);
Gulten Goudarzi, Coral Springs, FL (US);
Motorola Mobility LLC, Libertyville, IL (US);
Abstract
A module () can include a first substrate () comprised of a first material, at least a second substrate () comprised of at least a second material, selectively applied solder () of a first composition residing between the first substrate and at least the second substrate, and selectively applied solder () of at least a second composition residing between the first substrate and at least the second substrate. Preferably, no crack will exist in the module as a result of a reflow process of the solder due to the CTE mismatch between the first and second substrates. The different selectively applied solder compositions can have different melting points and can be solder balls, solder paste, solder preform or any other known form of solder.