The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2013

Filed:

Oct. 21, 2010
Applicants:

Hing Wah Chan, San Jose, CA (US);

Harold Ackler, Boise, ID (US);

Scott E. Solberg, Mountain View, CA (US);

John S. Fitch, Los Altos, CA (US);

David K. Fork, Mountain View, CA (US);

David G. Duff, Portola Valley, CA (US);

Michael C. Weisberg, Woodside, CA (US);

Inventors:

Hing Wah Chan, San Jose, CA (US);

Harold Ackler, Boise, ID (US);

Scott E. Solberg, Mountain View, CA (US);

John S. Fitch, Los Altos, CA (US);

David K. Fork, Mountain View, CA (US);

David G. Duff, Portola Valley, CA (US);

Michael C. Weisberg, Woodside, CA (US);

Assignees:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

SolFocus, Inc., Mountain View, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/042 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.


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