The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
May. 26, 2011
Chih Ching Lin, Taoyuan, TW;
Yi Nan Chen, Taipei, TW;
Hsien Wen Liu, Luzhu Township, TW;
Nanya Technology Corporation, Kueishan, Tao-Yuan Hsien,, TW;
Abstract
A method of via formation in a semiconductor device includes the following steps of providing a photoresist with a photoresist pattern defining an opening of a via, wherein the photoresist comprising a thermally cross-linking material is disposed on a structure layer; dry-etching the structure layer to a first depth through the opening; baking the thermally cross-linking material to reduce the opening; and dry-etching the structure layer to a second depth through the reduced opening, wherein the second depth is greater than the first depth.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile